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21 February 2014

Corporates get behind Oregon spin-out

Samsung, Intel, and Applied Materials all get behind latest round for Oregon State University semiconductor spin-out Inpria.

Author: Gregg Bayes-Brown, editor

Inpria, an Oregon State University semiconductor materials developer spin-out, has received $4.7m of a $7.3m committed total from a trio of corporate venture capital units.

Intel Ventures, Samsung Venture Investment, and Applied Ventures, the respective venture units of computer chip manufacturer Intel, smartphone and electronics giant Samsung, and semiconductor firm Applied Materials, all participated in the round.

The cash will be going towards supporting the commercialisation of Inpria’s primary tech: a portfolio of photocondensed molecular oxides designed to support the ever-smaller chipsets used in electronic devices.

Sean Doyle, director at Intel Capital, said: “Our industry needs materials innovation to continue to deliver the benefits of Moore’s Law to consumers. We’re excited by Inpria’s approach to driving improvements in performance and efficiency for manufacturing semiconductor devices on the leading edge of process technology.”

Copyright Mawsonia Limited 2010. Please don´t cut articles from or the PDF and redistribute by email or post to the web without written permission.

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